LUOWEI HS3 Preheating Platform Phone PCB Layering IC Glue Remover Oscilloscope and the temperature can be

and the temperature can be adjusted from 50 to 130 °C

screen will not fall off even if damaged

vacuum time

Gross Weight: 55kg

LUOWEI HS3 Preheating Platform Phone PCB Layering IC Glue Remover Oscilloscope and the temperature can beLuowei HS3 Uniform Preheat Platform Phone Motherboard CPU IC Heating Plate for mobile phone PCB board layering laminating chip glue removal, etc. Luowei HS3 99W constant temperature control preheating platform 65mm*100mm heating size suitable for various mobile phone motherboards tinning, degumming, and laminating, etc. Features: 1. Material construction: Made of aviation aluminum alloy, it not only improves durability but also ensures efficient